Wettability and Interfacial Reaction between Alumina and Cu-Based Alloys

研究成果: ジャーナルへの寄稿記事

3 引用 (Scopus)

抄録

In PTLP (partial transient liquid-phase) bonding, the transient liquid phase is sandwiched between a ceramic and a refractory core metal. A transient liquid phase chemistry that reduces the contact angle on the ceramic is necessary to improve strength characteristics. In this study, the effect of additions on the wetting characteristics of liquid Cu on an alumina substrate has been studied in parallel with the study of the joining of alumina through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers. While Ni additions do not reduce the contact angle of liquid Cu on an Al2O3 substrate, additions of 80Ni·20Cr or Cr alone do reduce the contact angle. The contact angle reduction depends upon the Cr content of the sessile drop. The average strength and the standard deviation of PTLP bonded alumina were 259 ± 25 MPa for 99.5% Al2O3 and 494 ± 61 MPa for 99.9% Al2O3, respectively. The resulting joints can exhibit a high bend strength at room temperature, strengths approaching those of the unbonded alumina, and a relatively narrow strength distribution. In both cases, failure occurred either entirely within the ceramic or primarily in the ceramic, with limited crack propagation along the alumina/interlayer interface.

元の言語英語
ページ(範囲)271-277
ページ数7
ジャーナルJournal of Materials Synthesis and Processing
6
発行部数4
出版物ステータス出版済み - 1998

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Aluminum Oxide
Surface chemistry
Wetting
Alumina
Contact angle
Liquids
Substrates
Joining
Refractory materials
Crack propagation
Multilayers
Metals

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

これを引用

Wettability and Interfacial Reaction between Alumina and Cu-Based Alloys. / Nakashima, Kunihiko.

:: Journal of Materials Synthesis and Processing, 巻 6, 番号 4, 1998, p. 271-277.

研究成果: ジャーナルへの寄稿記事

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