Wettability and interfacial reaction between Si3N4 and Cu-based alloys

K. Nakashima, T. Makino, K. Mori, A. M. Glaeser

    研究成果: Contribution to journalArticle査読

    1 被引用数 (Scopus)

    抄録

    The effect of additions on the wetting characteristics of liquid Cu on a Si3N4 substrate has been studied in parallel with the study of joining of Si3N4 using Cu/80Ni·20Cr/Cu interlayers. The addition of 80Ni·20Cr alloy and Cr reduced the contact angle of liquid Cu on a Si3N4 substrate. The contact angle reduction depended upon the Cr content of the sessile drop and anneal time. A multiphase reaction layer developed at the interface between the Cu-rich solidified droplet and Si3N4 when Cr or 80Ni·20Cr was added. The failure of Cu/80Ni·20Cr/Cu interlay er bonded Si3N4 occurred along the Si3N4/interlayer interface. At near the Si3N4/interlayer interface, a multiphase reaction layer has also developed. The strengths of bonded Si3N4 are strongly affected by the interfacial reaction products.

    本文言語英語
    ページ(範囲)287-292
    ページ数6
    ジャーナルKey Engineering Materials
    159-160
    出版ステータス出版済み - 12 1 1999

    All Science Journal Classification (ASJC) codes

    • 材料科学(全般)
    • 材料力学
    • 機械工学

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