Wettability and interfacial reaction between Si3N4 and Cu-based alloys

Kunihiko Nakashima, T. Makino, K. Mori, A. M. Glaeser

研究成果: ジャーナルへの寄稿記事

1 引用 (Scopus)

抄録

The effect of additions on the wetting characteristics of liquid Cu on a Si3N4 substrate has been studied in parallel with the study of joining of Si3N4 using Cu/80Ni·20Cr/Cu interlayers. The addition of 80Ni·20Cr alloy and Cr reduced the contact angle of liquid Cu on a Si3N4 substrate. The contact angle reduction depended upon the Cr content of the sessile drop and anneal time. A multiphase reaction layer developed at the interface between the Cu-rich solidified droplet and Si3N4 when Cr or 80Ni·20Cr was added. The failure of Cu/80Ni·20Cr/Cu interlay er bonded Si3N4 occurred along the Si3N4/interlayer interface. At near the Si3N4/interlayer interface, a multiphase reaction layer has also developed. The strengths of bonded Si3N4 are strongly affected by the interfacial reaction products.

元の言語英語
ページ(範囲)287-292
ページ数6
ジャーナルKey Engineering Materials
159-160
出版物ステータス出版済み - 12 1 1999

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Surface chemistry
Contact angle
Wetting
Liquids
Substrates
Reaction products
Joining
silicon nitride

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Wettability and interfacial reaction between Si3N4 and Cu-based alloys. / Nakashima, Kunihiko; Makino, T.; Mori, K.; Glaeser, A. M.

:: Key Engineering Materials, 巻 159-160, 01.12.1999, p. 287-292.

研究成果: ジャーナルへの寄稿記事

Nakashima, K, Makino, T, Mori, K & Glaeser, AM 1999, 'Wettability and interfacial reaction between Si3N4 and Cu-based alloys', Key Engineering Materials, 巻. 159-160, pp. 287-292.
Nakashima, Kunihiko ; Makino, T. ; Mori, K. ; Glaeser, A. M. / Wettability and interfacial reaction between Si3N4 and Cu-based alloys. :: Key Engineering Materials. 1999 ; 巻 159-160. pp. 287-292.
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