Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3

Hiroshige Matsumoto, M. R. Locatelli, Kunihiko Nakashima, A. M. Glaeser, K. Mori

研究成果: ジャーナルへの寄稿記事

10 引用 (Scopus)

抄録

The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.

元の言語英語
ページ(範囲)555-564
ページ数10
ジャーナルMaterials Transactions, JIM
36
発行部数4
DOI
出版物ステータス出版済み - 1 1 1995

Fingerprint

wettability
Wetting
liquid phases
interlayers
Liquids
liquids
vacuum
wetting
Vacuum
dissolving
Multilayers
Dissolution
temperature
Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

これを引用

Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3. / Matsumoto, Hiroshige; Locatelli, M. R.; Nakashima, Kunihiko; Glaeser, A. M.; Mori, K.

:: Materials Transactions, JIM, 巻 36, 番号 4, 01.01.1995, p. 555-564.

研究成果: ジャーナルへの寄稿記事

@article{c7e1e79631b04cb69cdd8596103fbf0c,
title = "Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3",
abstract = "The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.",
author = "Hiroshige Matsumoto and Locatelli, {M. R.} and Kunihiko Nakashima and Glaeser, {A. M.} and K. Mori",
year = "1995",
month = "1",
day = "1",
doi = "10.2320/matertrans1989.36.555",
language = "English",
volume = "36",
pages = "555--564",
journal = "Materials Transactions",
issn = "0916-1821",
publisher = "The Japan Institute of Metals and Materials",
number = "4",

}

TY - JOUR

T1 - Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3

AU - Matsumoto, Hiroshige

AU - Locatelli, M. R.

AU - Nakashima, Kunihiko

AU - Glaeser, A. M.

AU - Mori, K.

PY - 1995/1/1

Y1 - 1995/1/1

N2 - The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.

AB - The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al2O3 has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al2O3 has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al2O3 and facilitate the formation of reliably strong joint PTLP bonded Al2O3 using Cu/80Ni·20Cr/Cu interlayer.

UR - http://www.scopus.com/inward/record.url?scp=0029293957&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029293957&partnerID=8YFLogxK

U2 - 10.2320/matertrans1989.36.555

DO - 10.2320/matertrans1989.36.555

M3 - Article

VL - 36

SP - 555

EP - 564

JO - Materials Transactions

JF - Materials Transactions

SN - 0916-1821

IS - 4

ER -