Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3

Hiroshige Matsumoto; M. R. Locatelli; Kunihiko Nakashima; A. M. Glaeser; K. Mori

doi:10.2320/matertrans1989.36.555

Wettability of Al₂O₃ by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al₂O₃

Hiroshige Matsumoto, M. R. Locatelli, Kunihiko Nakashima, A. M. Glaeser, K. Mori

研究成果: ジャーナルへの寄稿 › 記事

10 引用（Scopus）

抜粋

The effect of additions (Cr, Ni and 80Ni·20Cr alloy) on the wetting characteristics of liquid Cu on Al₂O₃ has been studied using a sessile drop method in a vacuum at 1150°C. Through the use of microdesigned multilayer Cu/80Ni·20Cr/Cu interlayers, PTLP (Partial Transient Liquid-Phase) bonding of Al₂O₃ has been achieved in a vacuum at 1150°C. These results demonstrate that the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al₂O₃ and facilitate the formation of reliably strong joint PTLP bonded Al₂O₃ using Cu/80Ni·20Cr/Cu interlayer.

元の言語	英語
ページ（範囲）	555-564
ページ数	10
ジャーナル	Materials Transactions, JIM
巻	36
発行部数	4
DOI	https://doi.org/10.2320/matertrans1989.36.555
出版物ステータス	出版済み - 1 1 1995

フィンガープリント

All Science Journal Classification (ASJC) codes

Engineering(all)

これを引用

Matsumoto, H., Locatelli, M. R., Nakashima, K., Glaeser, A. M., & Mori, K. (1995). Wettability of Al₂O₃ by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al₂O₃. Materials Transactions, JIM, 36(4), 555-564. https://doi.org/10.2320/matertrans1989.36.555

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文献にアクセス

10.2320/matertrans1989.36.555